DIRECT TO SUBSTRATE COATING VIA IN SITU POLYMERIZATION
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United States of America Patent
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Issued Date -
Oct 7, 2021
app pub date -
Jun 21, 2021
filing date -
Dec 19, 2018
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Abstract
Disclosed is a process that utilizes a modified Atom Transfer Radical Polymerization (ATRP) process to form a water-resistant coating in situ on a substrate. The process uses solvent soluble monomers, initiator and ligand to form a solvent insoluble water-resistant polymer coating that is deposited directly onto a metal trace on the substrate. The process is especially useful for providing a water-resistant coating to the circuits on a printed circuit board, wearable electronics, and biological sensors. The process can be run in an aqueous solvent in the open atmosphere and does not require a vacuum, heating steps or masking. The coating is deposited only on the metal trace and closely adjacent areas of the substrate.
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