POLYIMIDE FILM FOR METAL LAMINATION AND POLYIMIDE METAL LAMINATE USING SAME
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United States of America Patent
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Sep 16, 2021
app pub date -
Oct 27, 2017
filing date -
Oct 31, 2016
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Abstract
The present invention discloses a polyimide film for metal lamination, which is obtained by providing at least one surface of a heat-resistant polyimide layer with a metal bonding layer. This polyimide film has a 5% weight loss temperature of 500° C. or higher in a nitrogen atmosphere, while having a dielectric loss tangent of 0.007 or less at a frequency of 11.4 GHz. It is preferable that the metal bonding layer is formed of a thermally fusible polyimide, or is formed of a heat-resistant polyimide and a silane coupling agent. The present invention also discloses a polyimide metal laminate which is obtained by additionally laminating a metal layer on a surface of the above-described polyimide film for metal lamination, said surface having been provided with the metal bonding layer.
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