HIGH BANDWIDTH ULTRASONIC TRANSDUCER WITH METAL BACKING LAYER AND METHOD OF FABRICATION
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United States of America Patent
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Sep 16, 2021
app pub date -
Mar 9, 2021
filing date -
Mar 12, 2020
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Abstract
An ultrasonic transducer includes a delay line substrate, a piezoelectric element, a metal conductive layer between the delay line substrate and the piezoelectric element, and a backing layer applied to the piezoelectric element. The delay line substrate and the piezoelectric element are acoustically joined, configured to couple ultrasonic waves from the piezoelectric element into the delay line substrate or from the delay line substrate into the piezoelectric element. The backing layer includes a metal film, the metal film has a thickness and an acoustic impedance, and the thickness and the acoustic impedance each have value sufficient to provide acoustic damping. The backing layer has a substantially columnar cross-sectional morphology with a substantially granular surface morphology.
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