HIGH DENSITY NEURAL IMPLANTS FOR BRAIN-MACHINE INTERFACES

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United States of America Patent

APP PUB NO 20210260364A1
SERIAL NO

17260903

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Abstract

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A system includes an implanted autonomous microchiplet communicatively linked to an epidermal skinpatch having a transceiver and a demodulator, an intermediate device communicatively linked to the epidermal skinpatch, the intermediate device configured to receive neural signals for decoding from the epidermal skinpatch and to send encoded signals for patterned stimulation to the epidermal skinpatch, and one or more external devices communicatively linked to intermediate device.

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Patent Owner(s)

Patent OwnerAddress
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA1111 FRANKLIN ST 5TH FLOOR OAKLAND CA 94607

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asbeck, Peter Michael Del Mar, US 2 2
Laiwalla, Farah Barrington, US 5 64
Larson, Lawrence Ernest Providence, US 2 2
Lee, Jihun Providence, US 43 147
Leung, Vincent Wingching San Diego, US 2 2
Mercier, Patrick San Diego, US 35 222
Nurmikko, Arto Providence, US 7 36
Rao, Ramesh La Jolla, US 6 8

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