HIGH DENSITY NEURAL IMPLANTS FOR BRAIN-MACHINE INTERFACES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 26, 2021
app pub date -
Jul 16, 2019
filing date -
Jul 17, 2018
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A system includes an implanted autonomous microchiplet communicatively linked to an epidermal skinpatch having a transceiver and a demodulator, an intermediate device communicatively linked to the epidermal skinpatch, the intermediate device configured to receive neural signals for decoding from the epidermal skinpatch and to send encoded signals for patterned stimulation to the epidermal skinpatch, and one or more external devices communicatively linked to intermediate device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully