NOTEBOOK BATTERY PROTECTION CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME

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United States of America Patent

APP PUB NO 20210257283A1
SERIAL NO

17178364

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Importance

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Abstract

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Provided is a notebook battery protection circuit package including a package substrate, a fuel gauge integrated circuit (FGIC) module mounted on the package substrate, a protection integrated circuit (IC) module mounted on the package substrate, a charge/discharge transistor module mounted on the package substrate, and a mold provided on the package substrate to encapsulate the FGIC module, the protection IC module, and the charge/discharge transistor module into one.

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Patent Owner(s)

Patent OwnerAddress
ITM SEMICONDUCTOR CO LTD60 YANGCHEONG 3-GIL OCHANG-EUP CHEONGWON-GU CHEONGJU-SI CHUNGCHEONGBUK-DO 28116

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Hyeon Soo Chungcheongbuk-do, KR 3 1
GU, Ja Guen Chungcheongbuk-do, KR 7 8
HWANG, Ho Seok Gyeonggi-do, KR 25 152
JEONG, Seong Hwan Chungcheongbuk-do, KR 2 0
NA, Hyuk Hwi Chungcheongbuk-do, KR 20 41
SONG, Chi Sun Chungcheongbuk-do, KR 4 1

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