Multi-point thermocouples and assemblies for ceramic heating structures
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United States of America Patent
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Oct 3, 2023
Grant Date -
Aug 12, 2021
app pub date -
Feb 12, 2020
filing date -
Feb 12, 2020
priority date (Note) -
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Abstract
Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.
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