Polyimide precursor-containing aqueous composition, method for producing polyimide film, and method for producing porous polyimide film

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United States of America Patent

PATENT NO 11680156
APP PUB NO 20210238392A1
SERIAL NO

17149724

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A polyimide precursor-containing aqueous composition contains at least one polymer material selected from the group consisting of a water-insoluble fibrous organic substance and a polyalkylene oxide having a viscosity-average molecular weight of 5 million or more, a polyimide precursor, particles, and water.

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FUJIFILM BUSINESS INNOVATION CORPMINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Hidekazu Kanagawa, JP 99 338
Kashima, Yasunobu Kanagawa, JP 50 110
Nakada, Kosuke Kanagawa, JP 18 5
Sasaki, Tomoya Kanagawa, JP 148 474
Yoshimura, Kosaku Kanagawa, JP 25 24

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