Electronic package and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11764162
APP PUB NO 20210210435A1
SERIAL NO

16997173

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Abstract

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An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

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Patent Owner(s)

  • SILICONWARE PRECISION INDUSTRIES CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chia-Yang Taichung, TW 43 139
Chen, Chih-Wei Taichung, TW 315 1688
Tsai, Ming-Fan Taichung, TW 20 48
Tsai, Tsung-Hsien Taichung, TW 135 513
Yang, Chao-Ya Taichung, TW 13 145

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