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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
RESONAC CORPORATION	TOKYO

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
AMANO, Yoshihiro	Chiyoda-ku, Tokyo, JP	5	20
FUJIMOTO, Daisuke	Chiyoda-ku, Tokyo, JP	32	213
INOUE, Hidetoshi	Chiyoda-ku, Tokyo, JP	43	358
KIGUCHI, Kazuya	Chiyoda-ku, Tokyo, JP	10	6
NISHIYAMA, Tomoo	Chiyoda-ku, Tokyo, JP	15	69

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jan 8, 2029
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jan 8, 2033

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2021/0206,906

RESIN COMPOSITION, RESIN MEMBER, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE

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