METHOD AND APPARATUS FOR TREATING A SUBSTRATE
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United States of America Patent
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Jul 1, 2021
app pub date -
Sep 14, 2018
filing date -
Oct 19, 2017
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Abstract
A method of treating a substrate or of manufacturing a treated substrate includes the following steps:
- a) first treating a substrate in a first atmosphere of a first pressure,b) subsequently, second treating the first treated substrate in a second atmosphere of a second pressure, wherein the second temperature of the substrate is different from the first temperature and the second pressure is lower than the first pressure,c) between steps a) and b) locking in the first treated substrate from the first atmosphere into the second atmosphere,d) during locking in, heating or cooling the first treated substrate from the first temperature towards the second temperature.
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