Electronic device and its heat dissipation assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11089714
APP PUB NO 20210195800A1
SERIAL NO

16857581

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
QUANTA COMPUTER INCNO 188 WENHUA 2ND RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Cheng-Chang Taoyuan, TW 7 31
Lin, Ching-Ta Taoyuan, TW 1 0
Tsai, Yu-Ching Taoyuan, TW 18 75
Tsao, Lu-Lung Taoyuan, TW 10 42

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