Authentication apparatus and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11876917
APP PUB NO 20210184872A1
SERIAL NO

17185856

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Abstract

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An interface element connected to a device and a security die-chip are fabricated in a single package. The security die-chip may provide a security authentication function to the interface element that does not have the security authentication function. The security die-chip may include a physically unclonable function (PUF) to provide a private key, and a hardware security module to perform encryption and decryption using the private key.

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Patent Owner(s)

Patent OwnerAddress
ICTK HOLDINGS CO LTDGYEONGGI-DO 13488

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Byong Deok Seoul, KR 65 531
Jee, Kwang Hyun Guri-si, KR 14 306
Kim, Dong Kyue Seoul, KR 51 472

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