MICROELECTROMECHANICAL GYROSCOPE SYSTEM

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United States of America Patent

APP PUB NO 20210180952A1
SERIAL NO

16839811

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Abstract

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A microelectromechanical gyroscope system is provided. The system includes a first substrate, a second substrate, and a third substrate. The substrates respectively have a first fixing, a second fixing, and a third fixing surfaces. The system further includes a first sensing, a second sensing and a third sensing module boards respectively fixed to the fixing surfaces. Each sensing module board has several microelectromechanical gyroscopes. A signal processing control board is electrically connected to the first sensing module board, the second sensing module board, and the third sensing module board. Wherein the first substrate, the second substrate, and the third substrate are perpendicular to each other. With the above structure, on each system coordinate axis of the microelectromechanical gyroscope system, at least one gyroscope is aligned with it for data acquisition and measurement. Accordingly, the measurement accuracy of the system is improved.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL APPLIED RESEARCH LABORATORIES3F NO 106 SEC 2 HEPING E RD DA'AN DIST TAIPEI CITY 106

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Min-Yu Hsinchu, TW 2 1
Jan, Ying-Wen Hsinchu, TW 6 9
Lin, Chen-Tsung Hsinchu, TW 2 1
Tsai, Yung-Fu Hsinchu, TW 3 4
Wu, Kuo-Liang Hsinchu, TW 4 103
Wu, Yeong-Wei Hsinchu, TW 10 79

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