COPPER POWDER, METHOD FOR MANUFACTURING COPPER POWDER, AND METHOD FOR MANUFACTURING SOLID SHAPED OBJECT
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United States of America Patent
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Jun 17, 2021
app pub date -
Jan 12, 2018
filing date -
Apr 21, 2017
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Abstract
The present invention provides a copper powder which is capable of fusion bonding with a low energy laser by enabling heat to be efficiently inputted with a high absorption rate for laser irradiation and has high convenience in handling, and provides a method for manufacturing the copper powder. One embodiment of the present invention is a copper powder, having an absorption rate for light having a wavelength λ=1060 nm of 18.9% to 65.0%, and an index, which is indicated by (the absorption rate for light having a wavelength λ=1060 nm)/(an oxygen concentration), of 3.0 or more.
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