Method for manufacturing a micromechanical layer structure
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United States of America Patent
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Aug 2, 2022
Grant Date -
Jun 3, 2021
app pub date -
Dec 6, 2018
filing date -
Jan 11, 2018
priority date (Note) -
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Abstract
A method for manufacturing a micromechanical layer structure, including: providing a first protective layer patterned to have at least one opening which is filled with sacrificial layer material; depositing a functional-layer layer structure; producing a first opening in the functional-layer layer structure to at least one opening of the first protective layer, so that in at least one of the layers of the functional-layer layer structure; depositing a second protective layer so that the first opening is filled with material of the second protective layer; patterning the second protective layer and the filled first opening to have a second opening to the first protective layer, the second opening having the same or a lesser width than the first opening; removing sacrificial layer material at least in the opening of the first protective layer; and removing protective layer material at least in the second opening.
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