ADHESIVE FILM AND FLEXIBLE PRINTED CIRCUIT BOARD

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United States of America Patent

APP PUB NO 20210163790A1
SERIAL NO

17109440

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Abstract

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An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10−10 cc·cm/cm2·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.

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Patent Owner(s)

Patent OwnerAddress
MEKTEC CORPORATION12-15 SHIBA-DAIMON 1-CHOME MINATO-KU TOKYO 105-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOMORI, Hiroyuki Kanagawa, JP 13 40
OBA, Hisae Tokyo, JP 3 3
SUZUKI, Nozomu Kanagawa, JP 10 47

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