High density waveguide assembly for millimeter and 5G applications
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United States of America Patent
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Nov 22, 2022
Grant Date -
May 27, 2021
app pub date -
Jul 1, 2020
filing date -
Nov 25, 2019
priority date (Note) -
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Abstract
Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.
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