RESONANCE DEVICE AND MANUFACTURING METHOD OF RESONANCE DEVICE

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United States of America Patent

APP PUB NO 20210152148A1
SERIAL NO

17162163

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Abstract

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A resonance device that includes a MEMS substrate including a resonator, an upper lid, and a bonding portion bonding the MEMS substrate and the upper lid to seal a vibration space of the resonator. The bonding portion includes a eutectic layer containing a eutectic alloy as a main component thereof. The eutectic alloy is composed of a first metal containing aluminum as a main component thereof, a second metal of germanium or silicon, and a third metal of titanium or nickel.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTD10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO-FU 617-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dehara, Kentarou Nagaokakyo-shi, JP 2 0
Fukumitsu, Masakazu Nagaokakyo-shi, JP 36 26

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