Cutting apparatus capable of detecting configuration abnormalities of a cutting blade
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United States of America Patent
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Mar 12, 2024
Grant Date -
May 6, 2021
app pub date -
Oct 27, 2020
filing date -
Oct 31, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A cutting apparatus includes a management unit having a measuring unit for measuring an amount of light emitted from a light emitter and received by a light receiver while a cutting blade is positioned between the light emitter and the light receiver, a measured waveform forming section for forming a measured waveform representing the configuration of an outer circumferential region of the cutting blade, and an ideal waveform recognizing section for recognizing one of the comparative waveforms that has the greatest number of waveform regions similar to the measured waveform as an ideal waveform, a difference calculating section for calculating the area of a region where there is a difference between the measured waveform and the ideal waveform.
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