COPPER-NICKEL-SILICON ALLOYS WITH HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY
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United States of America Patent
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May 6, 2021
app pub date -
Jul 12, 2019
filing date -
Jul 12, 2018
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Abstract
A copper alloy that does not contain beryllium and has a 0.2% offset yield strength of at least 80 ksi and an electrical conductivity of at least 48% IACS is disclosed. The copper alloy contains nickel, silicon, chromium, manganese, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used for example, as a heat sink.
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