MULTILAYER FILM AND HEAT-RESISTANT ADHESIVE TAPE

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United States of America Patent

APP PUB NO 20210130653A1
SERIAL NO

16500265

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same.

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Patent Owner(s)

Patent OwnerAddress
DENKA COMPANY LIMITED1-1 NIHONBASHI-MUROMACHI 2-CHOME CHUO-KU TOKYO 1038338 ?1038338

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Junpei Gunma, JP 13 36
HIROKAWA, Yasushi Gunma, JP 6 6
IWASAKI, Takayuki Gunma, JP 52 409

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