DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

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United States of America Patent

APP PUB NO 20210130167A1
SERIAL NO

16937710

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Abstract

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A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Yang-Che Hsinchu City, TW 39 114
LIANG, Victor Chiang Hsinchu City, TW 108 292
LIN, Chen-Hua Douliu City, TW 54 292
LIU, Chwen-Ming Hsinchu, TW 39 374
TENG, Yi-Chuan Zhubei City, TW 54 510
TSENG, Huang-Wen Zhubei City, TW 33 116

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