POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREFROM, AND SOLID STATE IMAGE SENSOR COMPRISING THE SAME
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United States of America
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Apr 22, 2021
app pub date -
Mar 27, 2019
filing date -
Mar 27, 2019
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Abstract
The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6);
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