Diffusion Bonding Heat Exchanger

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20210116182A1
SERIAL NO

17040622

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Abstract

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A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO PRECISION PRODUCTS CO LTDHYOGO 660-0891

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJITA, Yasuhiro Amagasaki-shi, JP 103 1006
TAKAHASHI, Suguru Amagasaki-shi, JP 8 29
TOGO, Eiji Amagasaki-shi, JP 2 3
YAMAKOSHI, Munehisa Amagasaki-shi, JP 2 1

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