PARTITIONED SUBSTRATES WITH INTERCONNECT BRIDGE
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United States of America
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Issued Date -
Apr 15, 2021
app pub date -
Oct 11, 2019
filing date -
Oct 11, 2019
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.
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