RESIN MOLDED BODY

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20210108047A1
SERIAL NO

16492074

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a resin molded body having excellent electromagnetic wave shielding properties in a high-frequency region of 1 GHz or more. The resin molded body containing a thermoplastic resin, plate-like graphite, at least one of carbon black and metal fibers, the content of the plate-like graphite being 50 parts by weight or more and 200 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin, the carbon black having a DBP oil absorption of 100 ml/100 g or more and 600 ml/100 g or less, the metal fibers having a diameter of 5 μm or more and 20 μm or less, the metal fibers having a fiber length of 2 mm or more and 12 mm or less, and the content of at least one of the carbon black and the metal fibers being 1 part by weight or more and 50 parts by weight or less, relative to 100 parts by weight of the thermoplastic resin.

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Patent Owner(s)

Patent OwnerAddress
SEKISUI TECHNO MOLDING CO LTD2-10-4 TORANOMON MINATO-KU TOKYO 105-8566

International Classification(s)

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  • 2018 Application Filing Year
  • C08L Class
  • 3929 Applications Filed
  • 2370 Patents Issued To-Date
  • 60.33 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Takafumi Nara-city, Nara, JP 3 4
Masuda, Takuya Nara-city, Nara, JP 29 397
Matsumura, Ryuuji Nara-city, Nara, JP 3 2
Suenaga, Yuusuke Nara-city, Nara, JP 4 4

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Patent Citation Ranking

  • 2 Citation Count
  • C08L Class
  • 70.89 % this patent is cited more than
  • 4 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges12645099101 - 1011 - 2031 - 40010020030040050060070080090010001100120013001400

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