SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20210090910A1
SERIAL NO

17111556

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus comprises: a first chamber; a liquid film former which forms a liquid film P of a solution containing a sublimable substance having sublimability on a surface of a substrate in the first chamber; a second chamber 30 which receives the substrate W having the liquid film; a plate unit 311 provided in the second chamber such that the substrate W is placeable on an upper surface thereof; a temperature controller 312, 335 which controls a temperature of the upper surface of the plate unit 311 to a predetermined temperature; and a heater 322 which heats and sublimates the sublimable substance precipitated from the solution on the substrate W placed on the plate unit 311.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDKYOTO-SHI KYOTO 602-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIYA, Katsuhiko Kyoto, JP 59 868

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