Integrated optical/electrical probe card for testing optical, electrical, and optoelectronic devices in a semiconductor die
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United States of America Patent
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May 4, 2021
Grant Date -
Mar 18, 2021
app pub date -
Sep 13, 2019
filing date -
Sep 13, 2019
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Abstract
A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.
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