INTEGRATED CIRCUIT DEFECT DIAGNOSIS USING MACHINE LEARNING
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United States of America Patent
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Feb 11, 2021
app pub date -
Aug 6, 2020
filing date -
Aug 7, 2019
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Abstract
A three-phase diagnosis methodology capable of effectively diagnosing and classifying multiple defects in integrated circuits comprises a first phase identifying a defect that resembles traditional fault models, and second and third phases that utilize the X-fault model and machine learning to identify correct candidates.
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