Integrated circuit packages having electrical and optical connectivity and methods of making the same
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United States of America Patent
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Jul 9, 2024
Grant Date -
Feb 11, 2021
app pub date -
Apr 3, 2019
filing date -
Apr 3, 2018
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Abstract
Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).
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