HEADPHONES AND HEADPHONE SYSTEMS
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United States of America Patent
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Issued Date -
Feb 4, 2021
app pub date -
Oct 16, 2020
filing date -
Jun 22, 2016
priority date (Note) -
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Abstract
Some headphone systems include two ear cups, a headband assembly, an interface system and a control system. Each ear cup may include an ear cup enclosure, an ear pad assembly, a speaker system and a hinge assembly. The hinge assembly may be disposed within the ear cup enclosure such that it is not visible from outside the ear cup. The headband assembly may connect with each of the ear cups via the hinge assembly. The interface system may include at least one interface and a plurality of input source buttons disposed on at least one of the ear cups. Each of the input source buttons may be configured for selecting a source of audio data received via the at least one interface. The control system may be configured for controlling the speaker system to reproduce audio data received via the interface and selected by one of the input source buttons.
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