Method for producing a connection between component parts

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11694977
APP PUB NO 20210035934A1
SERIAL NO

17046209

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.

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Patent Owner(s)

Patent OwnerAddress
OSRAM OPTO SEMICONDUCTORS GMBHLEIBNIZSTR 4 REGENSBURG 93055

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hingerl, Kurt Wolfern, AT 12 48
Hoenle, Michael Parsberg, DE 1 2
Huppmann, Sophia Geldersheim, DE 11 138
Katz, Simeon Regensburg, DE 20 150
Wagner, Thorsten Altenberg, AT 2 2

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