COOLING DEVICE AND COOLING SYSTEM USING COOLING DEVICE

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United States of America Patent

APP PUB NO 20210022265A1
SERIAL NO

17061468

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a cooling device that can exhibit excellent cooling characteristics while avoiding increase in size of the device, and a cooling system using the cooling device. The cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant sealed in an inside of the container, and a condensation tube through which a secondary refrigerant flows, and which penetrates through a gaseous phase portion inside of the container.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTDTOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOKI, Hirofumi Tokyo, JP 115 512
INAGAKI, Yoshikatsu Tokyo, JP 41 123
KAWABATA, Kenya Tokyo, JP 46 346
OKADA, Hiroshi Tokyo, JP 247 2273
TORATANI, Tomoaki Tokyo, JP 23 108

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