SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, AND EDGE RING
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United States of America Patent
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Issued Date -
Jan 21, 2021
app pub date -
Jul 10, 2020
filing date -
Jul 19, 2019
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Abstract
There is provision of a substrate support assembly including an edge ring, a substrate support, and a thermal conductivity adjuster. The substrate support has a central portion that supports a substrate, and an outer peripheral portion that supports the edge ring arranged around the substrate. The thermal conductivity adjuster is in contact with a part of the edge ring in a circumferential direction, and a thermal conductivity of the thermal conductivity adjuster is different from a thermal conductivity of the edge ring.
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