SEMICONDUCTOR MODULE
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United States of America Patent
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Issued Date -
Jan 21, 2021
app pub date -
Jun 2, 2017
filing date -
Jun 2, 2017
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Abstract
Provided is a semiconductor module which enables a memory bandwidth to be widened, and which enables data transfer efficiency to be improved by reducing power consumption. A semiconductor module 1 comprises: an interposer 10; and a processing unit 20 which has a plurality of processing unit main bodies 21 arrayed to be side by side with each other in a first direction F1 along the plate surface of the interposer 10, and which is placed on the interposer 10 so as to be electrically connected to the interposer 10. The processing unit main bodies 21 are provided with a plurality of subset units 22 each including: one arithmetic unit 23 including at least one core 25; and one memory unit 24 that is configured from a stacked-type RAM module and that is disposed to be side by side with the calculation unit 23 in the first direction F1. The plurality of subset units 22 are arrayed to be side by side with each other in a second direction F2 that intersects with the first direction F1.
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