METHOD FOR PROCESSING ELECTRONIC AND ELECTRICAL DEVICE COMPONENT SCRAP
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United States of America Patent
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Jan 21, 2021
app pub date -
Mar 18, 2019
filing date -
Mar 16, 2018
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Abstract
Provided is a method for processing electronic and electrical device component scrap, which can increase an amount of electronic and electrical device component scrap processed in a smelting step and efficiently recover valuable metals. The method for processing electronic and electrical device component scrap includes: a step 1 of removing powdery materials and film-shaped component scrap from the electronic and electrical device component scrap; a step 2 of concentrating synthetic resins and substrates from the electronic and electrical device component scrap from which the powdery materials and film-shaped component scrap have been removed; and a step 3 of concentrating the substrates containing valuable metals from a concentrate obtained in the step 2.
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