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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
RESONAC CORPORATION	TOKYO

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fujimoto, Daisuke	Tokyo, JP	32	213
Kiguchi, Kazuya	Tokyo, JP	10	6
Nishiyama, Tomoo	Tokyo, JP	15	69
Sakamoto, Norihiko	Tokyo, JP	22	233

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Apr 24, 2027
7.5 Year Payment	$3600.00	$1800.00	$900.00	Apr 24, 2031
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 24, 2035

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 24, 2023	US,11795293,B2   US11795293B2	GRANTED PATENT AS SECOND PUBLICATION
January 21, 2021	US,20210016546,A1   US20210016546A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2021/0016,546

EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, CURED PRODUCT, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE

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