APPARATUS AND METHOD FOR TREATING SUBSTRATE

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United States of America Patent

APP PUB NO 20210013008A1
SERIAL NO

16918219

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is an apparatus for treating a substrate. The substrate treating apparatus includes a substrate supporting unit for supporting the substrate and fixing the substrate with electrostatic force, a plasma generating unit for generating a discharging plasma for discharging a charge of the substrate, and a power supplying unit for supplying power to the substrate supporting unit and the plasma generating unit, wherein the power supplying unit supplies power of a fluctuating pattern to the plasma generating unit when a charge of the substrate is discharged.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDCHUNGNAM SOUTH KOREA JEOLLANAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Jun Pyo Gyeonggi-do, KR 46 1459
Lee, Ki Yung Gyeonggi-do, KR 5 10
Lee, Seungbae Gyeonggi-do, KR 31 662

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