SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING SUBSTRATE FOR PRINTED CIRCUIT BOARD, AND COPPER NANO-INK
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United States of America Patent
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Jan 7, 2021
app pub date -
Dec 21, 2018
filing date -
Mar 13, 2018
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Abstract
According to one aspect of the present invention, a substrate for a printed circuit board includes: an insulating base film; and a metal layer that covers an entirety or a part of one or both surfaces of the base film, wherein the metal layer includes a sintered body layer of copper nanoparticles, and wherein the sintered body layer includes nitrogen atoms by greater than or equal to 0.5 atomic % and less than or equal to 5.0 atomic %.
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