RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Jan 7, 2021
app pub date -
Mar 18, 2019
filing date -
Apr 2, 2018
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Abstract
Resin powder includes aggregates of spherical particles of a resin composition. The resin composition contains: a resin component including a thermosetting resin; and a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle.
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