COMPOSITION FOR PRETREATMENT FOR ELECTROLESS PLATING, PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD
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United States of America Patent
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Dec 31, 2020
app pub date -
May 23, 2018
filing date -
May 23, 2017
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Abstract
The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
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