POLYIMIDE PRECURSOR RESIN COMPOSITION FOR FORMING FLEXIBLE DEVICE SUBSTRATE
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United States of America Patent
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Issued Date -
Dec 31, 2020
app pub date -
Dec 27, 2018
filing date -
Dec 28, 2017
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Abstract
A polyimide precursor resin composition for forming a flexible device substrate, including a polyamic acid having a structure obtained from a tetracarboxylic acid component including at least one of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, a diamine component including at least one of paraphenylene diamine and 4,4′-diaminodiphenyl ether, and a carboxylic acid monoanhydride, the polyamic acid satisfying equations (1) and (2) below:
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- G02F:DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF ....
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