POLISHING SOLUTION AND POLISHING METHOD

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United States of America Patent

APP PUB NO 20200369918A1
SERIAL NO

16636965

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a method for polishing an article including a Co-containing portion to be polished by a polishing liquid, in which the polishing liquid contains water, abrasive particles, and a metal dissolving agent, a pH of the polishing liquid is 6.0 or more, and a content of hydrogen peroxide in the polishing liquid is 0.0001% by mass or less based on the total mass of the polishing liquid.

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Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL CO LTDCHIYODA-KU TOKYO 100-6606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INOUE, Keisuke Chiyoda-ku, Tokyo, JP 125 1631
KONDO, Shunsuke Chiyoda-ku, Tokyo, JP 21 58
OTSUKA, Yuya Chiyoda-ku, Tokyo, JP 12 12
OUCHI, Mayumi Chiyoda-ku, Tokyo, JP 2 2

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