PACKAGING STRUCTURE OF LIGHT EMITTING DIODE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 19, 2020
app pub date -
Jul 1, 2019
filing date -
May 13, 2019
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A packaging structure of an LED comprises a substrate with first surface, a first electrode arranged on the first surface, at least one light emitting chip on the first electrode, and a packaging body arranged on the first surface to cover the light emitting chip. The first surface defines at least one groove, part of the package body is in the groove. By increasing the contact area between the substrate and the packaging body or mounting an embedded structure on the substrate, the firmness of the bond between the packaging body and the substrate is improved.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully