COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER AND ELECTRONIC DEVICE INCORPORATING SILICA LAYER

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United States of America Patent

APP PUB NO 20200365400A1
SERIAL NO

16874820

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Abstract

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Disclosed is a composition for forming a silica layer including perhydropolysilazane (PHPS) and a solvent, wherein in an 1H-NMR spectrum of the perhydropolysilazane (PHPS) in CDCl3, when a peak derived from N3SiH1 and N2SiH2 is referred to as Peak 1 and a peak derived from NSiH3 is referred to as Peak 2, a ratio (P1/(P1+P2)) of an area (P1) of Peak 1 relative to a total area (P1+P2) of the Peak 1 and Peak 2 is greater than or equal to 0.77, and when an area from a minimum point between the peaks of Peak 1 and Peak 2 to 4.78 ppm is referred to as a Region B and an area from 4.78 ppm to a minimum point of Peak 1 is referred to as a Region A of the area of Peak 1, a ratio (PA/PB) of an area (PA) of Region A relative to an area (PB) of Region B is greater than or equal to about 1.5.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG SDI CO LTD150-20 GONGSE-RO GIHEUNG-GU YONGIN-SI GYEONGGI-DO 17084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BAE, Jin-Hee Suwon-si, KR 33 91
HWANG, Byeonggyu Suwon-si, KR 8 2
JANG, Seungwoo Suwon-si, KR 13 5
JO, Hyeonsu Suwon-si, KR 2 0
KIM, Euihyun Suwon-si, KR 6 11
KWAK, Taeksoo Suwon-si, KR 16 3
LEE, Chungheon Suwon-si, KR 6 0
LIM, Wanhee Suwon-si, KR 6 0
NOH, Kunbae Suwon-si, KR 10 105
SAKONG, Jun Suwon-si, KR 6 2

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