WAFER PROCESSING METHOD
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United States of America Patent
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Nov 12, 2020
app pub date -
Jul 24, 2020
filing date -
Jun 26, 2013
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Abstract
A method of wafer processing includes supporting a wafer in a process chamber. The method further includes introducing a flow of a gaseous material through an inlet of the process chamber to process the wafer. The method further includes generating, between the inlet and the wafer, controllable forces acting in various directions on the gaseous material to spread the gaseous material inside the process chamber.
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