INLINE VACUUM PROCESSING SYSTEM WITH SUBSTRATE AND CARRIER COOLING
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United States of America Patent
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Issued Date -
Nov 5, 2020
app pub date -
Apr 29, 2020
filing date -
May 2, 2019
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Abstract
A substrate processing system, including a processing module having at least one sputtering source; a first buffer module positioned on a first side of the processing module; a second buffer module positioned on a second side of the processing module directly opposite the first side; a first cooling module attached to the first buffer module; a second cooling module attached to the second buffer module; a transport system transporting substrate carriers in a straight line through the first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module; wherein the system is arranged linearly in the order: first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module.
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