Testing device includes radiation shields for testing integrated circuits on a wafer
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United States of America Patent
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Nov 23, 2021
Grant Date -
Nov 5, 2020
app pub date -
Apr 29, 2020
filing date -
May 3, 2019
priority date (Note) -
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Abstract
The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.
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