Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device

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United States of America Patent

PATENT NO 11440850
APP PUB NO 20200346982A1
SERIAL NO

16936761

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Abstract

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A material powder for additive modeling including a nitride, and a eutectic oxide, the nitride having an average density lower than an average density of the eutectic oxide, is used to produce a structure using an additive modeling method.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHATOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oshima, Kanako Tokyo, JP 42 123
Yabuta, Hisato Machida, JP 64 18000
Yasui, Nobuhiro Yokohama, JP 76 444

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