PHOTOSENSITIVE MODULE
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United States of America Patent
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Issued Date -
Oct 22, 2020
app pub date -
Apr 17, 2020
filing date -
Apr 19, 2019
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Abstract
A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.
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